Stacked computer circuit boards with connectors.

BGA QFN Specialty

Populating small and large BGA and QFN type components is our specialty. On a daily basis we install hundreds of these devices on PCBA with rejection rate typically 30 ppm.

NASA Quality

NASA, the military, and aerospace companies require the highest quality in electronic assemblies. In 1986, the US Navy certified Vital Systems to assemble weapons-grade electronics for military and space applications. This certification helped Vital Systems win many defense contracts. Today, we continue to set quality standards that our loyal customers have enjoyed for decades. We meet IPC-A-610 Class 3, the highest standards in soldering. 

Close-up of a complex electronic circuit board with multiple components.
Close-up of small electronic components with a ruler for scale.

Small PCBAs

Sanmina Corporation placed orders with Vital Systems to assemble, test 100% of these 750,000 tiny PCBA measuring 4 x 4 millimeter. We met the planned delivery schedule in 5 months. This was a Six Sigma run.

Rows of brass nozzles mounted on a perforated metal plate.

Large PCB Backplane

These large Back Plane 5 x 4 feet in size were assembled for Boeing and DARPA. We developed special machines for placement and soldering these assemblies.

A technician monitors medical imaging scans on multiple screens in a lab.

AOI Inspection

Our 3D Automated Optical Inspection systems allows the team to verify every component optically. With these incredibly powerful inspection machines we deliver the highest quality we are known for.

3D X-Ray Inspection

X-ray technology employed at Vital Systems typically used to X-Ray hidden from sight soldered connections.  Three dimensional imaging with video like continuous angular imaging brings even the smallest defects to the inspectors attention. This increases reliability of every PCBA we deliver. 

BGA, & Small Components

Computer chips arranged in a grid pattern.

Unassembled BGA

Miniaturization and large-scale integration has moved the electronics industry to pack more power and capabilities into Ball Grid Array (BGA) and Quad Flat No-Lead (QFN) devices. We specialize in populating these devices with less than 30 defects per million.

Tiny electronic components on a fingertip.

Small Components

With the precision of today’s process equipment, we can reliably install exceedingly small surface mount components like 0201 inch (0603 mm) and smaller yet, down to 01005 inch (0402 mm).

Wave Soldering

Mass soldering through hole components on PCB using wave soldering machine. Here the printed circuit boards skim over liquid solder at 500 degrees Fahrenheit. Solder connects the pads on the PCB and the exposed component pins. In few seconds hundreds of pins are reliabily soldered.

Electronic Testing

Programming & Testing

Post final assembly, cpu driven PCBAs are  powered to load firmware. If designed the firmware can perform built-in-test to check proper functioning of the PCBA.

In-Circuit Testing

Vital Systems offers biased in-circuit- testing. These tests can be performed on dedicated fixtures developed specifically at Vital Systems for complex PCBAs. Typically for ongoing large production runs. 

Full Function Testing

Vital Systems offers Full Function Test capabilities, when required we can also design and build these fixtures. Then perform full function tests after PCBAs are complete.

Flying Probe Testing

Customers require each passive and active component to be checked for proper device type, value, orientation, and soldered connection integrity. These tests can be baised or unbaised. 

Pride in Excellence

ISO9001:2015, IPC-A-610, Class 3